Application Field Product Description Product Model Product Form Product Features
Semiconductor Industry
Electronic Component Bonding		 A solvent-free, heat-curing adhesive with high strength and flexibility EB-321 Single Component Low viscosity, excellent anti-collapse after application, outstanding bonding strength, insulation resistance, and acid-alkali resistance, good thermal shock reliability
High Power Module Encapsulation Suitable for semiconductor industry, specifically for packaging components that generate significant heat, such as semiconductor modules, automotive electrical components, and relays. Low viscosity, long working time, suitable for various encapsulation designs. EB-873 A/B Two-Component High heat resistance (Tg > 200℃), low thermal expansion coefficient, excellent electrical properties, high bonding strength to materials, and good thermal shock reliability.
Phase Change Thermal Interface Pads Suitable for thermal interface materials for semiconductor/power devices, communication base station chip cooling, and automotive control module chip cooling. EB-PCM85 --- Softens at 45℃, maximizing wetting and filling of the substrate surface, thereby reducing interface thermal resistance.
Single Component Non-Curing Phase Change Thermal Paste Suitable for thermal interface materials for semiconductor/power devices, communication base station chip cooling, and automotive control module chip cooling. EB-PCM85SP --- Excellent thermal management performance; specially designed thixotropic properties ensure printability, anti-flow after assembly, and prevention of pump-out during use; no performance degradation after long-term accelerated aging tests in practical applications.
Dual-Curing Conformal Coating A low viscosity, single component, UV-moisture dual-curing conformal coating designed to protect circuit boards. EB-UV533 Dual Curing Low viscosity, solvent-free, low odor, low curing energy, fast curing speed, suitable for various UV lamp curing, specially designed pin protection enhancement performance, excellent coverage and protection for specific components on circuit boards.
Precision Control of Inductance Value Suitable for applications requiring precise control of inductance values, such as accelerometers, pressure sensors, inductors, and DC power supplies. GC01 Series Gap Adhesive Single Component Low-stress system, reduces damage to magnetic cores during curing. Offers a variety of sizes (particle size 10-600μm), allowing for precise control of gaps according to needs, high bonding strength to magnetic cores, and good thermal shock reliability.
Precision Control of Inductance Value Suitable for applications requiring precise control of inductance values, such as accelerometers, pressure sensors, inductors, and DC power supplies. GC02 Series Gap Adhesive Single Component Offers a variety of sizes (particle size 10-600μm), allowing for precise control of gaps according to needs, high bonding strength to magnetic cores, and good thermal shock reliability.
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